10.50mm [0.413"] 10.00mm [0.394"] 4.5mm [0.178"] 2.69mm [0.106"] 1.00mm [0.039"] 0.8mm typ. 8.00mm [0.315"] 6.40mm [0.252"] ? 0.20mm [? 0.008"] 2.05mm [0.081"] substrate: 1.59mm 0.18mm [0.062" 0.007"] fr4/g10 or equivalent high temp material. non-clad. side view top view d e s c r i p t i o n : surface mount foot 60 position bga land socket. status: released drawing: h. hansen scale: 4:1 rev: c date: 2/8/06 modified: 07/01/14 file: LS-BGA60F-61 dwg LS-BGA60F-61 drawing t o l e r a n c e s : diameters 0.03mm [0.001], pcb perimeters 0.13m m [0.005], pcb thicknesses 0.18mm [0.007"], pit ches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0 .005] unless stated otherwise. materials and spec ifications are subject to change without notice. 1 2 1 2 pins: material- brass alloy 360 1/2 hard; finish- 0.25m [10"] au over 1.27m [50"] ni (min.). ? 2006 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com
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